Thermal Pressurization Model Enhances Quake Predictability
Cause of Large Slip of Plate-Boundary Fault during the 2011 Tohoku-Oki Earthquake Clarified
Tags: Osaka University, Japan, Security & First Responders, Science & Exploration
Researchers from Osaka University discovered that the 2011 Tohoku-Oki earthquake's large fault slip was caused by friction-induced thermal pressurization, not the intrinsic weakness of fault materials. This process decreased stress on the fault, enabling the significant slip. They used rotary-shear friction experiments and dynamic rupture simulations to establish a method for predicting coseismic fault slip potential. This breakthrough aids in earthquake prediction and disaster prevention, particularly for the Nankai Trough earthquakes and global subduction zones. It offers a critical tool for assessing the risk of large-scale seismic events.
IP Type or Form Factor: Discovery & Research; Software & Algorithm
TRL: 6 - prototype validated in intended environment
Industry or Tech Area: Disaster Management & Recovery; Earth Sciences
