Safely, Sustainably Delaminate Foils from Semicon Wafers
Fabrication and Delamination of Multilayer Dielectric Foil
Tags: Australian National University, Australia, Industrial Automation & Manufacturing, Electronics & Robotics
ANU researchers have innovated a method for large-scale delamination of dielectric foil from semiconductor wafers, avoiding harsh chemicals and yielding flexible, functional foils. This process facilitates the creation of diverse optical heterostructures with potential applications in lasers, quantum and information technologies, aviation, and medical diagnostic tools. It promises safer production, design variety, and enhanced quality without contamination risks. This technology could revolutionize several industries by providing lightweight, high-functionality components.
IP Type or Form Factor: Process & Method; Material
TRL: Not specified
Industry or Tech Area: Sustainable Production Methods; Semiconductors
